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MUR1620CTRG, MURB1620CTRG, NRVUB1620CTRT4G
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5
PACKAGE DIMENSIONS
D2PAK?3 (TO
?263, 3?LEAD)
CASE 418AJ
ISSUE A
DIM MIN MAX MIN MAX
MILLIMETERS
INCHES
D
0.330 0.380 8.38 9.65
E
0.380 0.420 9.65 10.67
A
0.160 0.190 4.06 4.83
b
0.020 0.039 0.51 0.99
c2
0.045 0.065 1.14 1.65
e
0.100 BSC 2.54 BSC
A1
0.000 0.010 0.00 0.25
c
0.012 0.029 0.30 0.74
L
0.070 0.110 1.78 2.79
H
0.575 0.625 14.60 15.88
L2
????
0.070
????
1.78
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. CHAMFER OPTIONAL
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH. MOLD FLASH SHALL NOT EXCEED 0.005
PER SIDE. THESE DIMENSIONS ARE MEASURED
AT THE OUTERMOST EXTREMES OF THE
PLASTIC BODY AT DATUM H.
5. THERMAL PAD CONTOUR IS OPTIONAL WITHIN
DIMENSIONS E, L1, D1 AND E1.
6. OPTIONAL MOLD FEATURE
E1
0.245
????
6.22
????
L1
????
0.066
????
1.68
D1
0.260
????
6.60
????
L3
0.010 BSC 0.25 BSC
M
0808°° °°
E
D
H
L1
2X
b
e
A1
B
SEATINGPLANE
H
L
M
DETAIL C
A
B
A
M
0.10
M
c2
c
A
B
SEATINGPLANE
DETAIL C
VIEW A?A
SIDE VIEW
TOP VIEW
E2
L2
A
A
VIEW A?A
E1
D1
L1
OPTIONAL CONSTRUCTIONS
L3
GAUGEPLANE
NOTE 3
B
A
M
0.10
M
*For additional information on our Pb?Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
RECOMMENDED
0.366
0.100
PITCH
DIMENSIONS: INCHES
2X
0.169
0.653
0.063
2X
0.436
SOLDERING FOOTPRINT*
NOTE 6
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